摘要
The tensile behavior of Sn-0.7Cu and Sn-0.7Cu-1Zn was compared at various deformation temperatures. Refined microstructure and γ-CuZn particles were discovered with Zn addition. The strengths of Zn-containing solder were higher than that of Sn-0.7Cu at room and subzero temperatures. With the elevation of deformation temperature, they both decreased and they were nearly the same at 80 ？ C. The works of fracture exhibited the similar evolution law. For Sn-0.7Cu solder, the elongation after fracture was smaller and the reduction of area was bigger than those of Sn-0.7Cu-1Zn. This shows that Zn addition improved the deformation stability, which is attributed to the modification of the microstructure. Dimples in fracture surface became smaller and shallower with the decreasing temperature. Ductile fracture was discovered in all the samples.
The tensile behavior of Sn-0.7Cu and Sn-0.7Cu-1Zn was compared at various deformation temperatures. Refined microstructure and γ-CuZn particles were discovered with Zn addition. The strengths of Zn-containing solder were higher than that of Sn-0.7Cu at room and subzero temperatures. With the elevation of deformation temperature, they both decreased and they were nearly the same at 80 ？ C. The works of fracture exhibited the similar evolution law. For Sn-0.7Cu solder, the elongation after fracture was smaller and the reduction of area was bigger than those of Sn-0.7Cu-1Zn. This shows that Zn addition improved the deformation stability, which is attributed to the modification of the microstructure. Dimples in fracture surface became smaller and shallower with the decreasing temperature. Ductile fracture was discovered in all the samples.
