摘要
在温度为１２７３ ～１４２３ Ｋ、时间为０ ．９ ～７ ．２ ｋｓ 和０ ．１ ＭＰａ 压应力的条件下进行了Ｓｉ３Ｎ４／Ｔｉ／Ｎｉ／Ｔｉ／Ｓｉ３Ｎ４ 的部分瞬间液相连接， 结合ＳＥＭ， ＥＤＳ 和ＸＲＤ 测试结果， 分析了连接温度和时间对接头常温四点弯曲强度和断裂方式的影响。通过用反应层厚度来表征界面强度， 用σＲｅｓθｍａｘ 来评价近界面陶瓷断裂， 用σＲｅｓθ＝ ０ 来评价界面断裂， 建立了界面强度、陶瓷强度和残余应力与接头强度和三种断裂类型的关系模型。
Partial transient liquid phase bonding was performed using Ti/Ni/Ti multi interlayers on Si 3N 4 ceramic under the conditions of temperature 1 273～1 423 K, time of 0.9～7.2 ks and pressure of 0.1 MPa in a vacuum. The effects of bonding temperature and time on four point bending strength and fracture type of the joints were investigated, based on the experimental results by SEM, EDS and XRD analyses. By using the thickness of reaction layer to characterize the interfacial strength, using residual stress σ Re s θ max to evaluate the fracture in ceramic near the interface, and using residual stress σ Re s θ=0 to evaluate the fracture along the interface, a model has been proposed to describe the relationship between interfacial strength, ceramic strength, residual stress and joint strength, and three fracture types.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
1999年第A01期166-172,共7页
The Chinese Journal of Nonferrous Metals
