摘要
根据表面组装RC3216元件焊点的结构特征,采用数学分析方法建立了焊点形态的数学模型,预测了片式元件的SnAgCuRE系无铅钎料焊点形态,并对预测的焊点形态进行了试验验证。结果是预测结果与试验结果吻合很好,最大相对误差仅为7%。
According to the frame of soldered joints of the surface mount RC3216,the shape mathematic model of solder joints is established by applying the math analysis method.The shape of SnAgCuRE solder joints on the chip component was forecasted,and the relevant experiment was also carried out.The predicting results are in good agreement with the test results,and the maximum relative error is only 7%.
出处
《热加工工艺》
CSCD
北大核心
2011年第15期182-185,共4页
Hot Working Technology
