摘要
对国内外电子封装"锡基钎料/铜基板"焊点体系界面IMC形成与生长机理的研究进展进行了回顾、评述,重点阐述了界面IMC的形成与生长行为、形成热力学和生长动力学,简要评述了相关因素对界面IMC生长行为的影响。最后,对无铅化电子封装互连焊点界面IMC研究的发展趋势进行了展望。
Research advances in the formation and growth mechanism of interfacial IMC between the Sn-based solder and Cu substrate in interconnection solder joint of electronic packaging are reviewed and commented. The formation and growth behavior of interfacial IMC in lead-free solder joints, the thermodynamics of IMC formation and the kinetics of IMC growth are expounded. Some other factors which are related to the growth behavior of interracial IMC are also briefly proposed, In addition, the development trends of the research on interfacial IMC in lead-free electronic packaging are discussed.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第1期73-77,共5页
Electronic Components And Materials
基金
重庆市自然科学基金资助项目(No.cstc2011jjA40016)
重庆科技学院"优秀创新人才培养资助计划"资助项目(No.201102)
重庆科技学院"大学生科技创新培养训练计划"资助项目(No.201120)
关键词
电子封装
焊点
综述
界面IMC
热力学
动力学
electronic packaging
solder joint
review
interfacial IMC
thermodynamics
kinetics
