摘要
钨铜复合材料具有高导电导热性、抗电弧烧蚀性与高温稳定性等优异特点,在电子器件与耐高温器件中具有很好的应用前景.对当前钨铜复合材料的最新研究成果进行了分析,介绍了当前钨铜复合材料的应用、制备和致密化技术,对钨铜复合材料的进一步应用与发展进行了展望.
The W-Cu composite has some excellent features,such as good electric conduction,good heat conductivity,resistance against electric arc erosion and fusion welding and high temperature stability and it has good application future among electron device and those resistant to elevated temperatures.Recent research achievements both in domestic and abroad about W-Cu composite were analyzed and the application,preparation and densification technology were introduced in hope to indicate a way for the further application and development of W-Cu composite.
出处
《成都大学学报（自然科学版）》
2011年第4期364-367,共4页
Journal of Chengdu University（Natural Science Edition）
关键词
钨铜复合材料
制备方法
应用领域
高性能
W-Cu composite
preparation method
application filed
high performance
