摘要
通过大量实验数据及图表论述了化学镀ＮｉＣｕＰ的工艺条件，探讨了镀液的主要组成、镀液的ｐＨ 值、施镀时间对镀层中Ｎｉ、Ｃｕ 、Ｐ含量及镀层的沉积速度的影响，总结了随工艺参数变化镀层成分变化的趋势及规律。文中还简述化学镀ＮｉＣｕＰ镀层成分与组织结构的关系。
Technology of electroless plating Ni Cu P alloy were investigated through a great deal experiments. Influence of component and pH of the bath and plating time on the content of Ni, Cu, P in the coating and the deposition rate of the alloy was discussed and tendency of coating component with changing technology parameters was summarised.
出处
《电镀与环保》
CAS
CSCD
北大核心
2000年第1期18-21,共4页
Electroplating & Pollution Control
