摘要
采用扫描电子显微镜及STR-1000微焊点强度仪器,研究了Sn-9Zn-0.06Nd/Cu钎焊接头在150℃时效过程中界面组织形貌和力学性能的变化.结果表明,Sn-9Zn-0.06Nd/Cu接头焊接后的界面生成了较为平坦的金属间化合物层Cu5Zn8,随着时效时间的增加,金属间化合物层不断增厚.经过时效处理,钎料中的稀土元素Nd向界面富集并在界面附近生成了Nd3Sn相,同时微焊点的拉伸力不断减小,当时效720 h后,焊点的拉伸力下降了近50%.时效后焊点断裂方式由韧性断裂向脆性断裂转变.
The interface morphology and mechanical property of Sn-9Zn-0.06Nd/Cu soldered joints after aging treatment at 150 ℃ were investigated with scanning electronic microscope(SEM) and STR-1000 joint strength tester.The experimental results indicated that a planar Cu5Zn8 intermetallic layer(IMC) formed in the soldered joint interface,whose thickness increased with increasing aging time,and the rare earth element Nd migrated towards the interface and reacted with Sn forming Nd3Sn near the interface.While increasing the aging time,the tensile stress of the Sn-9Zn-0.06Nd/Cu micro-joints decreased,and it even reduced by 50% after aging for 720 h.The fracture mode of the soldered joints turned from ductile fracture before aging treatment to both ductile and brittle fracture after aging for 720 h.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2012年第3期41-44,115,共4页
Transactions of The China Welding Institution
基金
2010年度江苏省企业研究生工作站资助项目
关键词
时效
金属间化合物
界面组织
力学性能
aging treatment
intermetallic compound
interface morphology
mechanical property
