摘要
基于ANSYS平台,建立了半导体制冷箱温度场数值分析的三维模型,对制冷箱的内胆形状、制冷片的布置方位、个数、排列方式以及保温层的厚度进行了仿真并优化,再通过具体实验验证。结果表明:当半导体制冷箱的容积为10升时,制冷片安置在制冷箱的顶面,制冷片的数量为3片且呈三角形方式排列,箱体内胆的长宽高分别为320mm、210mm、150mm,保温层的厚度为20mm时,是一种比较理想的结构,能实现半小时内将环境温度(30℃)降到0～5℃的要求。
This paper described a three dimensional model of semiconductor refrigerating box temperature field numerical a nalysis based on ANSYS. The simulation and optimization and the experimental verification of the refrigeration box liner shape, the cooling plate layout orientation, quantity, arrangement and the thickness of insulation layer were made. The results show that： when the semiconductor refrigeration box has a capacity of 10 liters, cooling pieces are placed in the refrigerating box top surface, the quantity of the cooling pieces is 3 pieces while they are made in triangular arrangement, box liner length width and height are 320mm, 210mm and 150mm, and insulating layer thickness is 20mm, the semiconductor refrigerating box is an ideal structure and it could make ambient temperature （30℃） down to 0 5℃ within half an hour.
出处
《低温与超导》
CAS
CSCD
北大核心
2012年第11期70-75,共6页
Cryogenics and Superconductivity
基金
北京市教育委员会科技发展计划资助项目(KM201010011007)
关键词
半导体制冷
温度场
ANSYS
仿真
优化设计
Semiconductor cooling, Temperature field, ANSYS, Simulation, Optimal design
