摘要
以C72500(Cu-9.5Ni-2.3Sn)合金为研究对象,采用了金相显微镜、SIGMASCOPE SMP10型导电仪、XL30/TWP扫描电镜(SEM)、EDAX能谱仪、X射线衍射仪等仪器,研究不同Si含量(0.15%,0.20%,0.25%)对C72500合金铸锭的显微组织、电导率、硬度的影响。实验研究结果表明:随着Si在C72500合金中含量的不断增加,合金铸态组织呈现明显的树枝晶状,且枝晶发达,晶粒不断得到细化。能谱分析显示:未添加硅的Cu-9.5Ni-2.3Sn合金中第二相主要是NiSn和Ni3Sn相。随Si含量的增加,合金中第二相的种类不断增加,合金中出现Ni2Si,Ni3Si相。Ni2Si,Ni3Si是强化相,且新产生的第二相使合金组织晶格畸变更小,因此,铸态C72500合金的硬度及电导率随硅含量的增加而提高。当Cu-9.5Ni-2.3Sn合金中的Si含量为0.25%时,铸态合金的电导率和硬度分别为11.8%IACS和HB171.7,比未为添加硅Cu-9.5Ni-2.3Sn合金的电导率及硬度分别增加了24.2%和242.0%。
C72500 （Cu-9.5Ni-2.3Sn） alloy was studied. The effects of silicon content （0.15%, 0.20% and 0.25 % （mass fraction） ） on the microstrueture and performance, conductivity and hardness of C72500 alloy were investigated by metallographic microscopy, SIGMASCOPE SMP10-type conductivity meter, XL30/TWP （SEM） , EDAX energy disperse spectroscopy, minified X-ray diffrac- tion （XRD）. The results showed that the second solid phases were NiSn and Ni3Sn in the alloy without Si. The variety of secondary phases enhanced with the increase of Si, Ni2Si and Ni3 Si phases occurred in the alloy with the increase of silicon content in the alloy as-east, and the dendrite structure beeame obviously. Ni2Si and Ni3Si were strengthening phases, and decreased the lattice distortion, so the electrical conductivity and hardness of the alloys as-east enhaneed with the increase of silicon content. When the silicon content reached 0.25%, the peak conductivity and hardness of alloy as-cast was 11.8% IACS and HB 171.7 respectively, comparing with the Cu-9.5Ni-2.3Sn alloy without Si, the conductivity and hardness of alloy as-cast increased 24.2% and 242.0% respectively.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2012年第6期884-888,共5页
Chinese Journal of Rare Metals
基金
江西省自然科学基金(2009GZC0048)资助项目
江西省钨铜重点实验室开放基金(2010-WT-03)资助项目
江西省科技厅资助项目(2009DTZ01800)
