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Cu-Ni-Si-Mg合金的时效特性 被引量:9

Aging behavior of Cu-Ni-Si-Mg alloy
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摘要 通过电导率、硬度、XRD、动力学4个方面研究Cu-2.4Ni-0.57Si-0.1Mg合金4种工艺下最佳的电导率与硬度配合。结果表明,试验合金经过热轧后在450℃时效4 h的硬度和电导率的配合最佳,综合性能达到最高点;通过时效处理从过饱和固溶体中析出Ni2Si相,使合金导电性上升,同时硬度也可大幅度提高。随着温度和时间的增加,发生了过时效现象,析出相长大,失去共格特征,Ni2Si又逐渐溶解到基体中,缺陷也逐渐减少,导致硬度显著下降。 By means of conductivity,hardness tests,XRD and dynamic analysis,Cu-2.4Ni-0.57Si-0.1Mg alloy's aging properties were researched to find the best combination of the conductivity and the hardness.The results show that the alloy through hot-rolled processing and 450 ℃ aging treatment for 4 h is the best one.The combination of the conductivity and the strength of the alloy reach the highest point.Through the aging treatment Ni2Si phase separates from crystal supersaturated,makes alloy conductive and strength increase greatly.With further increasing temperature and time,the over-aging phenomenon occurs,non-coherent precipitate phase forms and precipitate phase begins to grow,then Ni2Si begins to dissolved into the matrix as well as other defect,so the hardness of the alloy decreases markedly.
出处 《金属热处理》 CAS CSCD 北大核心 2013年第1期50-53,共4页 Heat Treatment of Metals
关键词 铜合金 时效 热处理 电导率 硬度 copper alloy aging heat treatment conductivity hardness
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  • 1李红霞,田保红,林阳明,李士凯,刘平.内氧化法制备Al_2O_3/Cu复合材料的再结晶行为[J].稀有金属材料与工程,2005,34(7):1039-1042. 被引量:9
  • 2刘技文,王子元.新型高导电Be-Ni-Cu合金性能研究[J].金属热处理,1996,21(1):39-41. 被引量:12
  • 3二冢练成.Development of copper alloy for leadframe[J].伸铜技术研究会志,1997,36(1):25-32.
  • 4曹育文.引线框架用高强高导铜合金研究[M].北京:清华大学,1999.57-66.
  • 5铃木竹四.The characteristics and processes in Cu-Ni-Si alloy heat treatment[J].伸铜技术研究会志,1994,33(1):152-160.
  • 6[1]Rensei F.Rensei Futatsuka development of copper alloy for leadframe [J].Journal of the Japan Copper and Brass Research Association,1997,36: 25-32.
  • 7[2]Naotsugu I.Behavor of pricipitation and recrystallization affect upon texture of Cu-Cr-Zr alloy [J].Journal of the Japan Copper and Brass Research Association,1993,32: 115-121.
  • 8[3]Motohisa M.High-strength and high-conductivity alloy KLF201 [J].Journal of the Japan Copper and Brass Research Association,1988,27: 93-98.
  • 9[4]Motohisa M.Development trends in new copper alloy for lead-frame [J].Journal of the Japan Copper and Brass Research Association,1990,29: 18-21.
  • 10[5]Motohisa M.Poformence of KFC-SH and KLF194-SHT copper alloys in high-strength and high-conductivity for lead frame [J].Journal of the Japan Copper and Brass Research Association,1990,29: 224-233.

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