摘要
采用无铬、低污染的MnO2–H2SO4–H2O体系对PC（聚碳酸酯塑料）表面进行微蚀。以微蚀后PC基板的表面形貌、水接触角及其与铜层间的粘结强度为性能指标,研究了膨润液中NMP（N甲基吡咯烷酮）含量及微蚀时间对微蚀效果的影响。用NMP体积分数为80%~85%的膨润液于35°C下对PC处理5min后,再在含30g/LMnO2、12.3mol/LH2SO4的胶体溶液中70°C微蚀时,可得到较理想的微蚀效果,其水接触角可低至33.8°,基板与铜层的粘结强度可高达0.88kN/m。
MnO2-H2SO4-H20 system was used to etch the surface of polycarbonate engineering plastic. The influence of NMP （N-methylpyrrolidone） content in swelling solution and etching time on etching effect was studied based on the surface morphology, water contact angle of etched PC sheet, and adhesion strength of subsequently plated copper coating on PC substrate. The best etching effect of PC was obtained after swelling in a solution containing 80%-85% （volume fraction） NMP at 35 ℃ for 5 min, and etching in a colloid containing 30 g/L MnO2 and 12.3 mol/L H2SO4 at 70 ℃. The water contact angle of etched PC substrate can be as low as 33.8°, and the adhesion strength of an electroplated copper coating to the PC substrate reaches 0.88 kN/m.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2013年第5期28-31,共4页
Electroplating & Finishing
基金
宁夏自然科学基金(NZ11254)
宁夏高等学校科学研究项目(宁教高[2011]263号文件)
宁夏师范学院创新团队子项目(ZZ201205)
