期刊文献+

Effect of alumina thickness on Al_2O_3/InP interface with post deposition annealing in oxygen ambient

Effect of alumina thickness on Al_2O_3/InP interface with post deposition annealing in oxygen ambient
在线阅读 下载PDF
导出
摘要 In this paper, the effect of alumina thickness on Al2O3/InP interface with post deposition annealing (PDA) in the oxygen ambient is studied. Atomic layer deposited (ALD) Al2O3 films with four different thickness values (5 nm, 7 nm, 9 nm, 11 rim) are deposited on InP substrates. The capacitance-voltage (C-V) measurement shows a negative correlation between the alumina thickness and the frequency dispersion. The X-ray photoelectronspectroscopy (XPS) data present significant growth of indium-phosphorus oxide near the Al2O3/InP interface, which indicates serious oxidation of InP during the oxygen annealing. The hysteresis curve shows an optimum thickness of 7 nm after PDA in an oxygen ambient at 500 ℃ for 10 min. It is demonstrated that both sides of the interface are impacted by oxygen during post deposition annealing. It is suggested that the final state of the interface is of reduced positively charged defects on Al2O3 side and oxidized InP, which degrades the interface. In this paper, the effect of alumina thickness on Al2O3/InP interface with post deposition annealing (PDA) in the oxygen ambient is studied. Atomic layer deposited (ALD) Al2O3 films with four different thickness values (5 nm, 7 nm, 9 nm, 11 rim) are deposited on InP substrates. The capacitance-voltage (C-V) measurement shows a negative correlation between the alumina thickness and the frequency dispersion. The X-ray photoelectronspectroscopy (XPS) data present significant growth of indium-phosphorus oxide near the Al2O3/InP interface, which indicates serious oxidation of InP during the oxygen annealing. The hysteresis curve shows an optimum thickness of 7 nm after PDA in an oxygen ambient at 500 ℃ for 10 min. It is demonstrated that both sides of the interface are impacted by oxygen during post deposition annealing. It is suggested that the final state of the interface is of reduced positively charged defects on Al2O3 side and oxidized InP, which degrades the interface.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第7期681-685,共5页 中国物理B(英文版)
基金 supported by the National Natural Science Foundation of China(Grant No.61204006) the Fundamental Research Funds for the Central Universities,China(Grant No.K50511250002) the National Key Science and Technology Special Project,China(Grant No.2008ZX01002-002)
关键词 AL2O3 oxygen annealing capacitance-voltage measurement hysteresis curve Al2O3, oxygen annealing, capacitance-voltage measurement, hysteresis curve
  • 相关文献

参考文献19

  • 1Zhang K, Cao M Y, Lei X Y, Zhao S L, Yang L Y, Zheng X F, Ma X H and Hao Y 2013 Chin. Phys. B 22 097303.
  • 2Zheng J J, Zhang G L, Guo Y X, Li X P and Chen W J 2007 Chin. Phys. 16 1407.
  • 3Ge J, Liu H G, Su Y B, Cao Y X and Jin Z 2012 Chin. Phys. B 21 058501.
  • 4Chan Y J, Pavlidis D, Razeghi M, Omnes F and Defour M 1989 Inst. Phys. Conf. Ser. 106 619424.
  • 5Chan Y J, Pavlidis D, Razeghi M, Jaffe M and Singh J 1988 Inst. Phys. Conf. Ser. 96 459.
  • 6Xuan Y, Wu Y Q, Lin H C, Shen T and Ye P D 2007 IEEE Electron Device Lett. 28 935.
  • 7Galatage R V, Dong H, Zhernokletov D M, Brennan B and Hinkle C L 2013 AppL Phys. Lett. 102 132903.
  • 8Benbakhti B, Ayubi-Moak J S, Kalna K, Lin D, Hellings G, Brammertz G, Meyer K D, Thayne I and Asenov A 2010 Microelectron. Reliab. 50 360.
  • 9Liu Z G, Sun X, Yang J, Cui S R, Chen C Y, Chang-Liao K S and Ma T P 2011 Appl. Phys. Lett. 99 222104.
  • 10Ren C, Yang H, Han D D, Kang J F, Liu X Y and Han R Q 2003 Chin. J. Semi. 24 1109.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部