摘要
针对集成电路向高密度、小型化、多功能化发展,介绍了国内外传统的和以铜为基复合新型的引线框架和电子封装材料的性能、研究、生产现状以及存在的问题。同时展望了铜合金及其复合的引线框架和电子封装材料的发展趋势。
In light of the fact that integrated circuits (IC) are growing denser.smaller and more multi-func
tional,the characteristics,present status,application prospect and existing problems of traditional and new copper-matrix for leadframe and electronic packaging materials is described.And the developing trends of the copper-matrix leadframe and electronic packaging materials are forecasted in this paper.
出处
《材料导报》
EI
CAS
CSCD
2002年第7期29-30,57,共3页
Materials Reports
