摘要
以有限元数值计算方法和 SPICE仿真软件为工具 ,通过对印制电路板 (PCB)耦合微带线的电磁兼容性预测 ,来对具有不同厚度 PCB的电磁干扰水平进行估计分析。并对利用屏蔽地线把低频信号迹线和高速数字信号迹线分开来降低 EMI水平的方法给以预测评估。最后归纳总结出影响 PCB电磁兼容性能的因素 ,找出 PCB设计中电磁兼容性 (EMC)适应性方法的指导性原则 ,为 PCB的电磁兼容性设计提供参考依据。
Applying the finite element method and SPICE simulating code to the printed circuit board (PCB) coupling microstrip lines, predict its crosstalks and use the results to analyzing the electromagnetic interference (EMI) levels of the PCB with different thick Also evaluate the effects that segregate the high-threat traces from sensitive traces by guard traces Therefore, find some facts that influence the EMI level of PCB and generalize the guidelines of electromagnetic compatibility ( EMC) adequate design
出处
《现代电子技术》
2002年第8期51-54,共4页
Modern Electronics Technique
