摘要
采用铜引线键合工艺生产的电子元器件在服役中会产生热,引起引线与金属化焊盘界面出现IMC(intermetallic compound,金属间化合物)。IMC的生长和分布将影响键合点的可靠性,严重时会出现"脱键",导致元器件失效。研究了焊点在服役过程中的演化,选取铜线键合产品SOT-23为试验样品,分析了在高温存储试验环境下焊点键合界面IMC的生长及微观结构变化情况。
The electronic components of copper wire bonding process will generate heat in service, which cause the IMC （intermetallic compound） in the interface between the wire and the metallic bonding pad. The growth and distribution of IMC will affect the reliability of the bonding point, when seriously appears the break of solder ball from pad which lead to the device invalidation. Selected copper wire bonding product SOT-23 for the test samples in order to researching the solder joints evolution in service process, analysised the growth and microstructure changes oflMC in HTST.
出处
《电子与封装》
2014年第6期4-6,共3页
Electronics & Packaging
