摘要
研究以硼氢化钠为还原剂、硝酸银为活化剂的金刚石表面化学镀铜工艺。使用XRD和EDS分析金刚石表面镀层的结构与成分,讨论渡液组分和工艺条件对化学镀铜的影响,并用体式显微镜观察了金刚石表面镀铜后的形貌。得到的最佳镀液配方与工艺条件是:NaBH41.5g/L,CuSO4·5H2O 20g/L,酒石酸钾钠15g/L,EDTA-2Na 20g/L,亚铁氰化钾65mg/L,双联吡啶15mg/L;溶液pH值13,反应温度60℃。结果表明运用本工艺可以在金刚石表面获得均匀的镀铜层。
Electroless copper plating on diamond surface with sodium borohydride as the reducing agent and silver nitrate as the activating agent was studied. XRD and EDS were adopted to analyze the structure and ingredients of clad layer on diamond surface. The effects of plating solution components and technological conditions on electroless copper plating were discussed, the morphology on diamond surface after copper plating was observed by an integrated microscope. The optimal electroless plating formula and technological conditions are as follows：NaBH41.5g/L,CuSO4·5H2O 20g/L, sodium potassium tartrate 15g/L,EDTA-2Na 20g/L, potassium ferrocyanide 65mg/L, bipyridyl 15 mg/L; pH 13 and temperature 60℃. The results show that the uniform copper plating layer on the diamond surface could be achieved by using the optimal process.
出处
《浙江理工大学学报（自然科学版）》
2015年第1期67-72,共6页
Journal of Zhejiang Sci-Tech University(Natural Sciences)
基金
国家自然科学基金项目(51302247)
关键词
金刚石
化学镀铜
配方
镀层
diamond
electroless copper plating
formula clad layer
