摘要
废旧电路板上元器件与线路板的解锡脱离是电路板资源化的关键。分析了国内外手工、机械、加热和化学4种解锡技术的发展,对可行的加热解锡和机械拆卸组合的工艺技术进行研究分析,提出了废旧电路板元器件解锡技术的研究方向和重点。
Anti-soldering electronic components from waste printed circuit boards （PCBs） is the key step of recycling. This study summarized the evolution of manual, mechanical, heating and chemical anti-soldering technology at home and abroad. Besides, we analyzed the combined process of heating anti-soldering technology and mechanical disassembly. Finally, the research direction and future research emphasis of anti-soldering electronic components from PCBs were predicted.
出处
《再生资源与循环经济》
2015年第6期32-35,共4页
Recyclable Resources and Circular Economy
基金
广东省科技厅高新技术产业化项目--工业攻关资助项目(2012B010500022)
关键词
废旧电路板
电子元器件
解锡
技术
waste printed circuit boards
Electronic components
anti-solder
Technique
