摘要
研究了无铅玻璃粘结相的熔点和含量对铜导电浆料性能的影响。采用四探针法测定铜膜的导电性,采用X射线衍射和显微组织分析对样品进行表征,并测定了铜膜的附着力。结果表明,低熔点无铅玻璃粉有利于防止铜粉高温氧化,且在较低烧结温度时,残余有机载体可以包覆铜粉,防止铜粉在低温烧结时氧化,制得的导电铜膜样品表面平整,微观组织致密,导电性好。当低熔点无铅玻璃粉含量为8%时,方阻为47.78mΩ/□,附着力为10N/cm^2左右,符合行业要求。
The effects of melting temperature and the contents of lead-free glass powders on the performances of the copper electronic paste was researched.The conductivity of the copper films of electronic paste is tested by four point probe method.The copper films is characterized by X-ray diffraction and metallographic microstructure analysis.And the adhesion between copper films and substrate is tested.The results shows that:lead-free glass powders with low melting point is beneficial to prevent the copper powders from being oxidized in the high temperature.Copper powders would be coated by residual organic carrier to antioxidize in the lower sintering temperature,so the copper films have density surface and good electrical conductivity.When content of lead-free glass powders is 8%,sheet resistance of copper films is 43.9mΩ/□and the adhesion between copper films and substrate is more than 10N/cm^2.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2016年第2期2130-2134,2138,共6页
Journal of Functional Materials
基金
陕西省科学技术研究发展计划资助项目(2013K09-33)
关键词
玻璃粉
导电浆料
铜粉
附着力
导电性
glass powders
electronic paste
copper powders
adhesion
electrical conductivity
