摘要
本文研究了化学共沉淀工艺制备的CoMnCuo系NTC热敏电阻元件在不同温度下的复阻抗谱 ,并建立了相应的模拟等效电路。根据Cole Cole图 ,我们获得了材料的晶粒、晶界电阻随温度的变化关系。结果表明 :晶粒、晶界电阻与温度均呈E指数关系 ,但晶界电阻远大于晶粒电阻。为此 ,我们与以往NTC热敏电阻的导电机制进行了比较 。
In this paper,complex impedance spectroscopy analysis for CoMnCuO based NTC thermistor prepared by oxalate co precepition processing was investigated under diffenrent temperature.Correspondingly,the appropriate simulative equivalent circuit was set up.From Cole Cole plot,The dependence of the grain resistance(Rg) and grain boundary resistance(Rgb) on temperature(T) was obtained.The results showed that the relation of natural logarithm exists between Rgb and T as well Rg and T,however,RgbRg.So,we concluded that Rgb has a more important contribution to conductance than Rg by comparing.
出处
《材料科学与工程》
CSCD
北大核心
2002年第3期386-389,共4页
Materials Science and Engineering
