摘要
为了确定无铅焊料中的孔洞含量,提出了一种单轴拉伸实验与卡尔曼滤波算法(KF)相结合的反演分析方法。该方法以单轴拉伸实验中获得的载荷—位移曲线为依据,结合有限元仿真,对焊层中的孔洞率进行反演辨识。反演结果表明:基于伪实验数据的孔洞率反演,所得到的最大误差保持在2%以下;针对真实试样的孔洞率反演,最大误差保持在3%左右。由此证明该方法在无铅焊料孔洞率的反演分析上是行之有效的。
To determine the void volume fraction of lead-free solder, an inverse analysis method based on an uniaxialtensile test with Kalman filter （KF） algorithm was proposed. In this method, the load-displacement curves from uniaxialtensile test were used in combination with finite element simulation to determine the void volume fraction inverse analysisof solder layer. Inverse analysis result shows that the error based on pseudo-experimental data is below 2% and the errorfrom real experimental specimen is lower than 3%. It indicates that the present inverse analysis method is effective and itsresult is reasonable.
出处
《电子元件与材料》
CAS
CSCD
2016年第6期92-97,共6页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.51375448
No.51375447)
