摘要
文章通过对不同设计方式的基板面铜铜厚范围、线路补偿、铜箔材料进行蚀刻因子的测试,并对蚀刻因子进行对比分析寻找其中的差异与规律,从而得到最适合高密集线路即40μm/40μm线路生产的控制参数。
The etching factors were tested according to test results of different design methods of copper thickness range, line compensation and copper foil. The difference and rules can be found after a comparable analysis of etching factor, and the most suitable production control parameters of 40 μm/40 μm line were given.
出处
《印制电路信息》
2016年第6期18-21,共4页
Printed Circuit Information
基金
湖南省战略性新兴产业科技攻关与重大成果转化项目(2015GK1046)
长沙市科技计划项目(K1508003-11)资助
关键词
蚀刻因子
铜厚
补偿值
线宽
Etching Factor
Compensation
Copper Thickness
Space
