摘要
针对温度控制系统的纯滞后的特点,根据电子封装模具温度精确控制的需要,提出了基于Smith预估器和模糊自适应PID控制器的温度控制系统的设计方法。首先,根据阶跃响应建立被控对象的数学模型,然后在被控对象的数学模型的基础上设计出Smith预估器;其次,建立Mamdani模糊模型,实时对增量PID控制器的3个参数进行修正;最后,实现电子封装温度控制的硬件系统和软件系统的设计。该设计解决了纯滞后对控制系统稳定性的不良影响,大大提高了温度控制的精度,并且基于此种方法的硬件系统和软件系统也易于实现,可靠性高,鲁棒性好。
By analyzing the pure time-delay of temperature control system,the design method of the temperature control system based on the Smith predictor and the fuzzy adaptive PID controller was proposed to meet the requirements for precise temperature control of the electronic packaging mould.Firstly,the mathematical model of the controlled object was established,and then the Smith predictor was designed based on the mathematical model;secondly,the Mamdani fuzzy model was established,and the three parameters of the incremental PID controller were modified in real time;finally,the hardware and the software system of electronic packaging temperature control were designed.This design method can effectively overcome the pure timedelay on the control system stability and greatly improve the precision of temperature control.It is easy to build the hardware and software system based on this kind of method which is feasible and reliable.
出处
《机械与电子》
2016年第11期62-65,共4页
Machinery & Electronics
