摘要
介绍了典型的电子封装用复合材料,着重介绍了不同类型的金属基复合材料（MMC）;综述了以铝碳化硅（SiC/Al）和Si/Al为代表的金属基复合材料的国内外研究现状和进展,阐述了SiC/Al复合材料常见的制备工艺,比较了粉末冶金、铸造法、喷射沉积、浸渗法等不同制备工艺的优缺点并讨论了不同制备工艺的影响因素,分析了这些工艺所制备的复合材料的热膨胀系数和热导率等热物理性能;介绍了SiC/Al复合材料在国内外航空航天、飞行器、民用汽车和光电子器件等领域的研究应用实例,在此基础上指出了目前研究还需解决的基础理论研究和多学科交叉等问题,展望了SiC/Al复合材料未来的研究和发展方向。
Typical electronic packaging composites are introduced,and the different kinds of metal-matrix composites（ MMCs） are emphatically introduced. The domestic and overseas research state and progress of MMCs represented by Si C/Al and Si/Al are reviewed. The common manufacturing process of the Si C/Al composites is expounded. The advantages and disadvantages of different manufacturing processes are compared,such as powder metallurgy,casting process,spray deposition and impregnation method,and their influencing factors are discussed. The thermophysical characteristics of the composites prepared by the manufacturing processes,including coefficient of thermal expansion,thermal conductivity and so on,are analyzed. The domestic and overseas research application examples of the Si C/Al composites in fields of aerospace,aircraft,civilian automobile and optoelectronic devices are also introduced. On this basis,the problems of basic theory research and multi-subject crossing in the present research are pointed,and the future research and develop directions of the Si C/Al composites are prospected.
作者
张晓辉
王强
Zhang Xiaohui;Wang Qiang(The 13th Research Institute, CETC , Shijiazhuang 050051, China)
出处
《微纳电子技术》
北大核心
2018年第1期18-25,44,共9页
Micronanoelectronic Technology
关键词
电子封装
金属基复合材料(MMC)
铝碳化硅
热膨胀系数
热导率
electronic packaging
metal-matrix composite（MMC）
SiC/Al
coefficient of thermal expansion
thermal conductivity
