摘要
选取埋入式基板中的传输线宽度、传输线厚度、传输线耦合长度、耦合间距和基板介电常数5个参数作为关键因素,建立了五因素四水平16种参数水平的正交实验表,进行了极差分析。结果表明:传输线间耦合间距对串扰影响最大,其次是传输线耦合长度,而基板介电常数、传输线宽度和传输线厚度对串扰影响较小;最优参数组合是W4T4S4L1D1,即传输线宽度15 mil,传输线厚度70μm,传输线间耦合间距2 mm,耦合长度5 mm,介电常数4.3。
Five process parameters of the embedded substrate, the width of transmission line, the thickness of transmission line,coupling length of transmission lines, the distance between transmission line and substrate dielectric constant were chosed as control factors. By establishing five factors and four levels orthogonal experiment table with 16 parameter levels, cross talk between trans-mission lines was analyzed. The results show that the distance between transmission lines is the greatest influence on the crosstalk,then the coupling length of transmission lines, and the substrate dielectric constant, the width of transmission line and transmission line thickness have little influence on the crosstalk. The optimal parameter combination is W4 T4 S4 L1 D1 with the transmission line width of 15 mil, the transmission line thickness of 70 μm, transmission line coupling distance of 2 mm, coupling length of 5 mm, a dielectric constant of 4. 3.
出处
《电子技术应用》
2018年第1期13-16,共4页
Application of Electronic Technique
基金
国家自然科学基金(51465012)
广西壮族自治区自然科学基金(2015GXNSFCA139006)
关键词
埋入式基板
传输线
串扰
正交设计
embedded substrate
transmission line
crosstalk
orthogonal design
