摘要
针对塑封器件键合铜线在高温环境下的贮存可靠性问题,进行铜线键合塑封器件的高温贮存试验。对经过高温贮存后的塑封器件进行无损开封,分析了高温贮存对铜键合线的拉伸强度和第一键合点剪切强度的影响。利用扫描电子显微镜（SEM）观察Cu/Al键合界面形貌及金属间化合物（IMC）的生长,采用X射线能谱仪（EDS）对IMC进行成分分析。研究结果表明,塑封器件Cu/Al键合界面在150℃贮存环境下IMC生成较少,EDS无法准确分析其成分,175℃和200℃贮存环境下生成的IMC包括Cu_3Al_2,Cu_9Al_4,CuAl和CuAl_2,且器件在200℃贮存28天后键合界面产生裂纹。随贮存时间的增加,键合铜线的拉伸强度逐渐减小,剪切强度先增加后急剧减小,且Cu/Al IMC的生长行为和成分特点符合试验过程中键合铜线键合强度的变化。
In view of the high temperature storage reliability problem about Cu bonding wire of plastic package devices, the storage test on this kind of devices at different high temperatures was carried out. Non-destructive deeapsulation of the plastic package devices after high temperature storage was finished. The influences of high temperature storage on pull strength of the Cu bonding wire and shear strength of the first bonding point were analyzed. The Cu/A1 bonding interface morphology and the growth of inter- metallic compound （IMC） were observed by the scanning electron microscope （SEM）. And the compo- sition of IMC was analyzed by the X-ray energy dispersive spectrometer （EDS）. The research results in- dicate that there is a little IMC in Cu/A1 bonding interface of plastic package devices at the storage tem- perature of 150 ~C , and the composition can＇t be analyzed clearly by EDS. However, at 175 ~C and 200 ~C , the generated IMC in Cu/A1 bonding interface mainly includes Cu3 A12, Cu9 A14, CuA1 and CuA12. The fracture generates in the bonding interface after storage for 28 days at 200 ~C. With the in- crease of storage time, the pull strength of Cu bonding wire gradually decreases, and the shear strength firstly increases and then sharply decreases. In addition, the growth behavior and composition characte-ristics of Cu/A1 IMC correspond to the variation of bonding strength for Cu bonding wires.
出处
《半导体技术》
CAS
CSCD
北大核心
2018年第2期154-159,共6页
Semiconductor Technology
