摘要
功率模块技术能够有效集成功率半导体器件,具有很多优点。简要介绍了功率模块的结构组成和工艺特点,对功率模块的失效进行了描述,并通过理论分析和试验验证,认为失效的主要原因是锡膏涂覆量的偏少和一次高温处理后焊盘可焊性的下降。基于功率模块的失效机理,通过采取增加锡膏涂覆量和对一次高温处理后焊盘进行搪锡的措施,有效保证了功率模块的焊接质量。
Power module technology can integrate power semiconductor devices effectively with many advantages.This paper introduces the structure composition and process characteristics of power module briefly and describes the failure. With theoretical analysis and test verification, the main cause of failure is considered as the less amount of solder coating and the decline of pad solderability after first high temperature treatment. Based on the failure mechanism of power module, with the measures of increasing solder coating amount and tinning on the pad after first high temperature treatment, the solder quality of power module is guaranteed effectively.
作者
韩彬
唐金秀
郭晓林
HAN Bin;TANG Jin-xiu;GUO Xiao-lin(Tianjin Institute of Power Sources,Tianjin 300384,chin)
出处
《电源技术》
CAS
CSCD
北大核心
2018年第5期707-709,共3页
Chinese Journal of Power Sources
关键词
功率模块
锡膏涂覆量
焊盘可焊性
power module
solder coating amount
pad solderability
