摘要
焊锡膏广泛应用于表面贴装焊接工艺中,作为主焊料,焊锡膏的性能优劣决定了焊接可靠性的高低。通过对焊锡膏的自身特性、与其它工艺辅料的兼容性以及焊点可靠性三方面进行研究试验,依据试验数据评价焊锡膏的性能,总结试验过程形成一套焊锡膏可靠性的验证方法。
Recently, solder paste has been widely used in surface mount. As a main soldering material, the reliability depends largely on the quality of solder paste. This paper conducts extensive experiments on the characteristic of solder paste, the compatibility with accessories, as well as solder joint reliability. According to the solder past performance and the experimental results, this paper formulated a practicable method on solder paste reliability evaluation.
出处
《自动化博览》
2018年第7期72-75,共4页
Automation Panorama1
