摘要
在建立集成电路制造领域国际合作专利数据库的基础上,采用专利关联度分析、社会网络分析等方法对世界各国进行国际技术合作的发展潜力、发展现状和合作效果进行分析,以把握该领域国际合作特征,揭示我国的优势和差距。结果发现:(1)美国在该领域拥有最强的技术创新及国际合作技术创新能力,德国与中国台湾则拥有较大的发展潜力;(2)亚、欧两洲因集群创新成为国际技术合作较成功区域,但集群内合作研究领域的趋同性阻碍了其进一步发展。最后,提出进一步提升我国国际合作水平的政策建议。
In this paper, the development potential, development status and cooperation effect of each country/re- gion in international technological collaboration are analyzed on the basis of establishing the database of interna- tional cooperation patent of IC manufacturing industry. Through the above analysis, we want to grasp the intema- tional cooperation characteristics of IC manufacturing industry, and reveal the advantages and disadvantages of China. Findings include the following： First, with regard to technological innovation and international collabora- tion innovation, the United States is most successful, while Germany and Chinese Taipei have great potential for future development; Second, Asia and Europe have become successful areas of international technical coopera- tion because of cluster innovation, but the convergence of cooperative research orientation hinder further improve- ment of the nodes inside the cluster. Finally, this paper puts forward some suggestions on how to further en- hance the level of international cooperation in China.
作者
刘云
闫哲
程旖婕
叶选挺
LIU Yun;YAN Zhe;CHENG Yijie;YE Xuanting(School of Public Policy and Management,University of Chinese Academy of Sciences,Beijing 100049,China;School of Management and Economics,Beijing Institute of Technology,Beijing 100081,China)
出处
《科学学与科学技术管理》
CSSCI
CSCD
北大核心
2018年第8期13-25,共13页
Science of Science and Management of S.& T.
基金
国家重点研发计划专项课题(2017YFB1401100)
国家自然科学基金项目(71810107004
71573017
71273030)
关键词
集成电路制造
专利计量
国际技术合作
社会网络分析
integrated circuit manufacturing
patent bibliometric
international technological collaboration
socialnetwork analysis
