摘要
目前,开关柜的温升问题非常突出。为降低开关柜温升,以KYN96-12的出线柜为研究对象,开展了开关柜温升影响因素的研究。本文针对不同环境温度、铜排规格、导体材料等因素,分别进行了开关柜仿真分析与试验研究。研究结果表明,初始环境温度对开关柜触头温升的影响较小,0℃与40℃下温升相差不到1℃;引出母排规格和断路器触臂(导体)材料对触头温升的影响较大,引出母排规格分别为80mm×10mm和120mm×10mm时温升相差3℃以上,触臂材料分别为铝和铜时温升相差2℃以上。
At present, the temperature rise problem of switchgear is very prominent. In order to reduce the temperature rise of the switchgear, the influence factors of temperature rise of high voltage switchgear are carried out by using the outlet cabinet of KYN96-12 as the research object. The simulation analysis and experimental study were carried out for the switchgear of different ambient temperature, copper bar specifications and conductor materials. The research results show that the initial ambient temperature has less influence on contact temperature rise of switchgear and the difference in temperature rise under 0℃ and 40℃ is less than 1℃. The copper bar specification and the material of circuit breaker’s contact arm have more influence on the temperature rise of the contact, the difference of temperature rise above 3℃when copper bar specification is 80mm×10mm and 120mm×10mm and above 2℃ when the contact arm’s material is aluminum and copper respectively.
作者
杜丽
丁永生
石维东
刘进
陆军
Du Li;Ding Yongsheng;Shi Weidong;Liu Jin;Lu Jun(Nari Group Corporation State Grid Electronic power Research Institute,Nanjing 211000;Jiangsu Nari Power Electric Co.,Ltd,Nanjing 211000;Shanghai Zhixin Electric Co.,Ltd,Shanghai 200335)
出处
《电气技术》
2018年第9期51-54,59,共5页
Electrical Engineering
关键词
开关柜
温升
仿真
试验
switchgear
temperature rise
simulation
test
