摘要
硅基光电子技术在其自身优势、市场需求、国家战略的带动下迅速发展,面临大规模市场化的历史机遇。指出了硅基光电子在硅基多材料体系、大容量信息技术、新型耦合和封装技术等层面所面临的关键问题,包括有源器件和异质集成问题、超高集成度硅基信息系统实现、高效耦合及封装等。认为建立科研成果和市场产品之间有效的联通桥梁,促进前沿科研和产业应用的协同合作是解决这一问题的有力手段。
Driven by its advantages,market demand and national strategy,siliconphotonic technology is developing rapidly,and approaching the opportunity of largescalemarketization.In this paper,the key problems of silicon photonics in siliconmulti-materials system,massive information technology,and new type of couplingand packaging are analyzed,including active devices and heterogeneous integration,ultra-high integration for silicon-based information system,efficient coupling andpackaging.Bridging the gap between scientific research and market product andboosting the collaboration of cutting-edge scientific research and industrialapplication are solutions to these problems.
作者
郝然
HAO Ran(Zhejiang University, Hangzhou 310027,China)
出处
《中兴通讯技术》
2017年第5期52-55,共4页
ZTE Technology Journal
关键词
硅基光电集成
多材料系统
光电封装
silicon photoelectric integration
multi-materials system
photoelectric package
