摘要
论证含铈镀层代金代银镀层的可能性,简介锡铈镀液的特点、镀层的性能及有关配方,探讨铈元素电化掺杂反应的机理.文章提供的配方及其工艺参数有一定的参考价值。
This paper proves the possibility of using the platings containing eerium to rep- lace the platings containing gold or silver,introduces briefly the characteristics of Sn-Ce plating solution as well as the performance and related formular,and finally discusses the mechanism of cerium element for its electrochemical reaction.In addi- tion,it provides with the formular and technological parameters,which holds some reference values.
出处
《表面技术》
EI
CAS
CSCD
1992年第6期251-257,共7页
Surface Technology
关键词
镀层
电镀
锡铈合金
frace cerium
Sn-Ce platings
reaction mechanism
