摘要
为了制备出抗氧化、纯度高且粒径分布窄的微米铜粉,以硫酸铜(CuSO4)为原料,抗坏血酸(Vc)为还原剂,聚乙烯吡咯烷酮(PVP)为保护剂和分散剂,浓氨水(NH3·H2O)调节pH值,通过液相还原法制备微米铜粉,研究了CuSO4浓度对制备粉体的影响,并讨论了相关反应机理。采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、能谱分析仪(EDS)、激光粒度仪和热重分析仪(TG)对制备的铜粉进行表征与分析。结果表明:不同CuSO4浓度下制得的粉体均为高结晶度的单质铜;当CuSO4浓度为0. 6 mol/L,反应温度为80℃时,制得的铜粉结晶度最好且粒径分布较窄,全都分布在1~4μm;制备出的铜粉抗氧化性和稳定性较好,在200℃时都不会发生氧化,于空气中放置30天后仍为单质铜。
To prepare micron copper powder with antioxidant performance,high purity and narrow size distribution,cupric sulfate( CuSO4),ascorbic acid( Vc),and polyvinyl pyrrolidone( PVP) were used as raw material,reducing agent,protective and dispersive agent respectively. And concentrated ammonia water( NH3·H2 O) was used to tune the pH value during reaction. Micron copper powder was prepared by reducing method in aqueous solution. The effect of CuSO4 concentration was researched,and the reaction mechanism was analyzed. The as-prepared copper powder was characterized by X-ray diffractometry( XRD),scanning electron microscopy( SEM),energy dispersive spectrometry( EDS),laser particle size analyzer and thermal gravimetric analyzer( TG). The results show that the powders prepared at different CuSO4 concentrations are all highly crystalline elemental copper. When CuSO4 concentration is 0. 6 mol/L and the reaction temperature is 80 ℃,the prepared copper powder has the best crystallinity and the narrowest size distribution mostly from 1 μm to 4 μm. It also shows good oxidation resistance,and no obvious oxidation can be observed at 200 ℃. After 30 days in air,the power is still in elemental form.
作者
王杜
苏晓磊
吉辰
刘毅
WANG Du;SU Xiaolei;JI Chen;LIU Yi(School of Materials Science&Engineering,Xian Polytechnic University,Xian 710048,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2020年第1期20-25,共6页
Electronic Components And Materials
基金
西安市科技局科技创新引导项目(201805030YD8CG14(14))
陕西省特殊人才支持计划
陕西高校青年杰出人才支持计划
关键词
微米铜粉
硫酸铜
粒径分布
抗氧化
micron copper powders
cupric sulfate
particle size distribution
anti-oxidation
