摘要
针对一种高功率器件在使用过程中镀金管壳底部发黑的问题,采用光学检查、扫描电镜、能谱分析以及XRD分析等手段对底部发黑区域的形貌、组成以及物质等进行分析和讨论。试验结果表明,功率器件装焊过程中流入的助焊剂导致底部发黑,黑色区域主要包括AuSn、Au、Sn以及CHO类物质,在温度和助焊剂的作用下,Sn通过晶界扩散的方式向管壳底部的Au中快速扩散,形成了AuSn金属间化合物。增加功率器件搪锡后及安装前清洗工序以及优化焊接后的清洗要求,可有效避免发黑现象的出现。
The surface blackening of gold-plated high power devices during use are studied by using OM,SEM,EDX,XRD,etc.The morphology,microstructure and composition of blackening areas are analyzed and discussed.The test results show that the main reason of blackening at bottom of power devices is soldering flux which flowed down during soldering.The blackening area is mainly composed of AuSn,Sn and CHO compounds.Under the action of high temperature and soldering flux,Sn diffused quickly into Au finishes through grain boundaries with the formation of AuSn intermetallic compound.
作者
蒋庆磊
王燕清
林元载
杨海华
李赛鹏
JIANG Qinglei;WANG Yanqing;LIN Yuanzai;YANG Haihua;LI Saipeng(The 14th Research Institute of CETC,Nanjing 210039,China)
出处
《电子工艺技术》
2020年第2期80-82,90,共4页
Electronics Process Technology
基金
装备预研共用技术项目(41423070401)。
