摘要
从提高效率、保证质量出发,提出了提高SOP封装的集成电路去金效率的解决方案。介绍了方案的具体实施方法,给出了结构件尺寸设计的思路。在生产实践中对这种方案进行了验证,和其他几种方法加以比较,证明其可靠性及实用性。
In order to improve the efficiency and guarantee the quality,this paper puts forward a solution to improve the efficiency of IC De-Golding in SOP package.The specific implementation method of the scheme is introduced,and the idea of dimension design of structural parts is given.The scheme is verified in production practice and compared with other methods to prove its reliability and practicability.
作者
向洲林
XIANG Zhoulin(Southwest China Institute of Electronic Technology,Chengdu 610036,China)
出处
《电子与封装》
2020年第8期7-10,共4页
Electronics & Packaging
关键词
去金
搪锡
镀金层
焊接
de-golding
tin-coating
gold-plated
soldering
