摘要
介绍半导体硅片制备技术及理论,分析目前全球硅片的产业概况、产业历史发展趋势及特点;结合我国目前的实际情况,论述国内大力发展硅片产业面临的机遇、挑战及存在的问题。
Based on the introduction of the basic theory and manufacturing technique of semiconductor silicon wafers,this article analyzes the current global industry situation,industrial development trends and characteristics of silicon wafers.It then discusses,based on the actual situation,the opportunities,the challenges and the existing problems to develop silicon industry in China.
作者
闫志瑞
库黎明
白杜娟
陈海滨
王永涛
YAN Zhirui;KU Liming;BAI Dujuan;CHEN Haibin;WANG Yongtao(GRINM Semiconductor Materials Co. , Ltd. , Beijing 100088, China)
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2020年第4期5-11,共7页
Diamond & Abrasives Engineering
关键词
半导体
硅片
产业现状
技术
机遇
挑战
semiconductor
silicon wafer
industry status
technique
opportunity
challenge
