摘要
随着电子器件趋于微型化、多功能化,微电子封装中的焊点与间距互连要求更小,对焊点的可靠性提出了更高的要求,而在电子封装中钎料对焊点可靠性起着至关重要的作用。近年来,人们越来越注重绿色发展理念,对铅的毒性关注度日益增强,并且各国纷纷立法禁止使用含铅钎料,推动了无铅钎料的快速发展。但是,现有无铅钎料均存在成本高、润湿性差、可靠性低等问题。因此,探索并研发性能优异的无铅钎料任重而道远。目前,许多研究者选择在无铅钎料中添加纳米颗粒以增强复合钎料的综合性能,如金属颗粒、金属化合物颗粒、碳基纳米材料等。研究表明,纳米颗粒的加入可以细化钎料基体组织,抑制金属间化合物(IMC)的生长,提高钎料的力学性能。因此,研发颗粒增强型无铅钎料以改善钎料合金的整体性能成为研究的热点。本文综合分析了不同类型、不同尺寸、不同含量的纳米颗粒对无铅钎料组织性能的影响与作用机理,综述了添加纳米颗粒对钎料的显微组织、润湿性能、力学性能、蠕变性能、电迁移特性和可靠性的影响。此外,概述了亚微米颗粒对三维封装互连焊点的改性作用。最后,总结了纳米颗粒增强无铅钎料的不足之处,并对其未来发展进行展望,以期为日后研发高性能的颗粒增强型无铅钎料提供基础理论指导。
As electronic devices tend to be miniaturized and multi-functional,the solder joints and spacing interconnection requirements in microelectronic packaging are smaller,which puts forward higher requirements for the reliability of solder joints,and solder plays a vital role in the reliability of solder joints in electronic packaging.In recent years,individuals pay more attention to the concept of green development and concern about the toxicity of lead,and quite a few countries have legislated to ban the use of lead-containing solder,which has promoted the rapid development of lead-free solder.Neverthelss,there are many problems in lead-free solder,such as high cost,poor wettability and reliability.Therefore,exploring and developing lead-free solders with excellent properties still has a long way to go.Nowadays,many researchers have chosen to add nano-sized particles in lead-free solder to enhance the comprehensive properties of composite solder,such as metal particles,metal compound particles,carbon-based nano-materials and so on.The results show that the addition of nanoparticles can refine the matrix structure,inhibit the growth of intermetallic compound(IMC)and improve the mechanical properties of solder alloys.Thus,the research and development of nanoparticle reinforced lead-free solder to improve the whole performance of the solder alloy has become a hotspot.In this paper,the effect and mechanism of different types,sizes and contents of nanoparticles on the structure and properties of lead-free solder is comprehensively analyzed.Then,the effects of nanoparticles on the microstructure,wetting ability,mechanical performance,creep property,electromigration properties and reliability of the solders are discussed.Additionally,the modificated effect of submicron particles on 3D encapsulation interconnect solder joints is summarized.Finally,the shortcomings and future prospects of reinforced lead-free solder are put forward in order to provide basic theoretical guidance for the future development of particle reinforced lead-free solder with great properties.
作者
李木兰
张亮
姜楠
孙磊
熊明月
LI Mulan;ZHANG Liang;JIANG Nan;SUN Lei;XIONG Mingyue(School of Mechatronic Engineering,Jiangsu Normal University,Xuzhou 221116,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;College of Mechanical&Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)
出处
《材料导报》
EI
CAS
CSCD
北大核心
2021年第5期5130-5139,共10页
Materials Reports
基金
国家自然科学基金(51475220)
江苏省“六大人才高峰”(XCL-022)
先进焊接与连接国家重点实验室开放课题重点项目(AWJ-19Z04)。
关键词
电子封装
无铅钎料
纳米颗粒
颗粒增强
electronic packaging
lead-free soldering
nanoparticles
particle reinforced
