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氧化铝陶瓷基板无钯活化化学镀镍新工艺 被引量:4

Palladium-Free Activation Electroless Nickel Plating on Alumina Ceramic Substrate
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摘要 研究了一种廉价且易于在氧化铝陶瓷上进行化学镀镍的无钯活化新工艺。以氧化铝陶瓷为基体,先通过碱处理进行改性,再通过热处理在陶瓷基体表面制备镍微粒,最后进行化学镀镍。通过单因素分析法研究了活化液浓度、活化温度及活化时间对活化效果的影响,采用扫描电镜观察基体各阶段表面形貌,并对活化后基体进行了能谱分析,通过热震试验对镀层的结合性进行评价。结果表明,当硫酸镍和次磷酸钠的浓度分别为20 g/L和80 g/L、活化温度为195℃、活化时间为8 min时对基体的活化效果最佳,活化后基体表面生成大量的活性镍微粒。施镀后,镀层结构均匀致密,覆盖率为100%,结合性和可焊性良好。 A new palladium-free activation process for electroless nickel plating on alumina ceramics was studied.Alumina ceramic was modified by alkali treatment,then nickel particles were prepared on the surface of ceramic substrate by heat treatment,and finally electroless nickel plating was carried out.The influence of activation solution concentration,activation temperature and activation time on the activation effect was studied by single factor analysis.The surface morphology of the substrate at each stage was observed by scanning electron microscope,and the matrix after activation was analyzed by energy spectrum.The adhesion of the coating was evaluated by thermal shock test.The results show that the best activation effect is obtained when the concentration of nickel sulfate and sodium hypophosphite are 20 g/L and 80 g/L,respectively,the activation temperature is 195℃,and the activation time is 8 min.After activation,a large number of active nickel particles are formed on the surface of the substrate.After plating,the structure of the coating is uniform and compact,with 100%coverage rate and good adhesion and weldability.
作者 张立红 唐光超 崔开放 ZHANG Lihong;TANG Guangchao;CUI Kaifang(Engineering Technology Center,Southwest University of Science and Technology,Mianyang 621010,Sichuan,China)
出处 《西南科技大学学报》 CAS 2021年第2期62-67,共6页 Journal of Southwest University of Science and Technology
关键词 化学镀镍 陶瓷 无钯活化 表面金属化 Electroless nickel plating Ceramics Palladium-free activation Surface melallization
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