摘要
真空直流断路器弧后介质恢复过程是决定其开断是否成功的重要物理过程,因而受到研究者的广泛关注。该文的主要目标是采用粒子模拟的方法研究真空断路器弧后金属蒸气击穿阶段的发展过程及影响因素,并基于粒子云网格(Particle in Cell)和蒙特卡罗碰撞(Monte Carlo Collision)相结合的PIC-MCC方法,建立弧后金属蒸气击穿模型,对金属蒸气击穿的发展过程进行空间2维速度3维的仿真模拟,然后讨论触头表面温度、金属蒸气密度、触头开距、电压等重要因素对击穿的影响。模拟结果表明:在一定范围内,增大金属蒸气的密度,击穿发生的更迅速;触头温度越高,击穿更容易发生;暂态恢复电压峰值越高,击穿发生更快。另外,当场强不变时,对于较小开距,击穿反而不太容易发生,当开距较大时,击穿发生的时间几乎不受开距的影响。
For the vacuum DC circuit breaker, the process of dielectric recovery after arc is an important physical process to determine whether the breaking is successful or not, thus it has been widely concerned by researchers. The main purpose of this paper is to study the development process and influencing factors of the breakdown stage of metal vapor in vacuum circuit breaker by particle simulation. Based on the Particle in Cell-Monte Carlo Collisions(PIC-MCC) method, a model of metal vapor breakdown after arc is established, and the development process of metal vapor breakdown is simulated in two-dimensional space and three-dimensional velocity. Then, the influences of some important factors, such as contact surface temperature, metal vapor density, contact distance, and voltage on breakdown are discussed. The simulation results show that, in a certain range, increasing the density of metal vapor, the breakdown occurs more rapidly;the higher the contact temperature is, the more prone to occur the breakdown is;the higher the peak value of transient recovery voltage is, the faster the breakdown occurs. In addition, when the field strength is constant, the breakdown is not easy to occur for a small opening distance, and when the opening distance is large, the breakdown time is hardly affected by the contact distance.
作者
赵雨
杨飞
孙昊
吴翊
纽春萍
荣命哲
ZHAO Yu;YANG Fei;SUN Hao;WU Yi;NIU Chunping;RONG Mingzhe(State Key Laboratory of Electrical Insulation and Power Equipment,Xi’an Jiaotong University,Xi’an 710049,China)
出处
《高电压技术》
EI
CAS
CSCD
北大核心
2021年第6期2141-2148,共8页
High Voltage Engineering
基金
国家重点基础研究发展计划(973计划)(2015CB251001)
国家自然科学基金(51521065)。
