摘要
芯片级封装是实现高光密度白光LED和减小封装体积的一种重要途径,而目前芯片级白光LED存在荧光层老化、荧光粉热猝灭等问题,严重影响白光LED的性能和可靠性。为此,本文结合荧光玻璃的技术优势,提出了荧光玻璃封装芯片级白光LED,并分析了白光LED光热性能。利用丝网印刷和低温烧结工艺在玻璃基片表面制备了荧光玻璃层,从而获得了晶圆级荧光玻璃片,再切割成芯片级荧光玻璃用于白光LED封装。分析了荧光玻璃层的微观形貌,荧光粉颗粒内嵌在玻璃基体中,膜层致密、无明显残余气孔;通过调节荧光玻璃层厚度优化了白光LED光学性能,当荧光玻璃层为120μm时,白光LED获得了最优光学性能,光效、色温和色坐标分别为111.8 lm/W、6876 K和(0.3074,0.3214);分析了荧光玻璃封装结构对白光LED光热性能的影响,荧光玻璃层靠近LED芯片封装具有更高的光效和更低的色温,同时白光LED表面温度更低。
Chip-scale packaging(CSP)is an important way to realize a white LED with high optical density and reduce its package size.However,chip-scale white LED has the problems of the aging of phosphor layer and the thermal quenching of phosphor,which seriously affect the performance and reliability of white LED.Herein,combined with the technical advantages of PiG,we proposed a phosphor-in-glass(PiG)packaged chip-scale white LED,and analyzed the photothermal performance of white LED.The PiG layer was prepared on the surface of glass substrate with the process of screen printing and low-temperature sintering,and then the PiG was cut into the chip-scale PiG for white LED packaging.The microscopic morphology of PiG was analyzed.The phosphor particles were embedded in the glass matrix,and the film layer displays a dense structure with no obvious residual pores.The optical properties of white LED were optimized by adjusting the thickness of PiG layer.When the thickness of PiG layer is 120μm,the related luminous efficiency(LE),correlated color temperature(CCT),and chromaticity coordinate are 111.8 lm/W,6876 K,and(0.3074,0.3214),respectively.The effect of PiG packaging structure on the photothermal performance of white LED was analyzed.The PiG layer close to LED chip packaging has higher LE and lower CCT,while the surface temperature of white LED is lower.
作者
张稀雯
余子康
牟运
彭洋
李俊杰
史铁林
ZHANG Xi-wen;YU Zi-kang;MOU Yun;PENG Yang;LI Jun-jie;SHI Tie-lin(School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;School of Aerospace Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China)
出处
《发光学报》
EI
CAS
CSCD
北大核心
2021年第12期1961-1968,共8页
Chinese Journal of Luminescence
基金
国家自然科学基金(51805196,51805197)
中央高校基本科研业务费专项资金(2020kfyXJJS092)资助项目。
关键词
白光LED
芯片级封装
荧光玻璃
光热性能
white LED
chip-scale packaging
phosphor-in-glass
photothermal performance
