摘要
针对印制电路板(PCB)用有机可焊保护剂(OSP)表面漂浮不溶物的问题,先分离提纯不溶物,再通过高效液相色谱(HPLC)、红外光谱(FTIR)、核磁共振波谱(NMR)以及质谱(MS)分析不溶物的成分。结果表明,该不溶物为一种双酰胺,主要是由于在制备OSP原料──2-(2,4−二氯苄基)苯并咪唑(HT204)时所用的多聚膦酸催化剂活性较低,导致部分中间体与过量2,4−二氯苯乙酸发生缩合反应而生成的。通过改用复合型催化剂Zn-B_(2)O_(3),减少2,4−二氯苯乙酸的投料量以及分批次投料后,上述问题得以解决。
Aiming at the problem that some insolubles suspended on the surface of organic solderability preservative(OSP)solution applied to printed circuit board(PCB),the insolubles were filtered and purified from OSP,and then analyzed by high-performance liquid chromatography(HPLC),Fourier-transform infrared(FTIR)spectroscopy,nuclear magnetic resonance(NMR)spectroscopy,and mass spectrometry(MS)to determine their composition.The results showed the insolubles are a bisamide derivative,which is produced by the condensation reaction of the excess 2,4-dichlorophenylacetic acid and some intermediates during the synthesis of 2-[(2,4-dichlorophenyl)methyl]-1H-benzimidazole(coded as HT204,one of the raw materials of OSP)due to the low catalytic activity of polyphosphonic acid.The problem can be solved by adopting a composite catalyst Zn-B_(2)O_(3) instead,reducing the dosage of 2,4-dichlorophenylacetic acid,and adding 2,4-dichlorophenylacetic acid in batches.
作者
凌意
赵鹏
翁行尚
张小春
黄嘉辉
LING Yi;ZHAO Peng;WENG Xingshang;ZHANG Xiaochun;HUANG Jiahui(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,China;Guangdong Key Laboratory of Industrial Surfactant,Institute of Chemical Engineering,Guangdong Academy of Sciences,Guangzhou 510665,China;Guangdong JINBAI Chemical Co.,Ltd.,Zhaoqing 526253,China)
出处
《电镀与涂饰》
CAS
北大核心
2022年第1期62-66,共5页
Electroplating & Finishing
基金
广州市科技计划项目(202102080461,201707010499)
肇庆市科技计划项目(2019K039)
广东省科技计划项目(2017A070701018,2017B030314137,2020B0101340005)。
关键词
印制电路板
有机可焊保护剂
不溶物
双酰胺
催化剂
printed circuit board
organic solderability preservative
insoluble residue
bisamide
catalyst
