摘要
在Sn-9Zn二元合金中加入(1~4)wt%的Bi元素和1 wt%的Ga元素得到新型低温无铅钎料,并进行了铜和铜的钎焊连接,并与三种传统含铅钎料钎焊铜/铜接头进行对比。探究了钎焊接头界面组织及其形成机理,分析了Bi和Ga元素对接头界面组织和力学性能的影响。结果表明,焊接接头区组织中黑色棒状富Zn相随着Bi元素的增加逐渐减少并变得细小;在接头区有颗粒状组织形成,经XRD和EDS分析为Cu_(5)Zn_(8)相和Cu_(6)Sn_(5)相;当Bi元素含量为3wt%时接头剪切强度和维氏硬度最高,分别为38.60 MPa和39.8 HV0.2。Bi含量为3 wt%的低温无铅钎料钎焊性能最优,接头力学性能最优。
New low-temperature lead-free solders were obtained by adding(1-4) wt% of Bi element and 1 wt% of Ga element to the Sn-9 Zn binary alloy, and copper and copper brazed joints were obtained. The traditional copper-copper joints of lead-containing solders were compared. The interface microstructure and formation mechanism of the joints were investigated.The effects of Bi and Ga elements on the interfacial microstructure and mechanical properties of the joints were analyzed. The results show that the black rod-like Zn-rich phase in the welded joint zone gradually decreases and becomes smaller with the increase of Bi element;granular structure is formed in the joint zone, which are Cu_(5)Zn_(8) phase and Cu_(6)Sn_(5) phase analyzed by XRD and EDS;when the Bi element content is 3 wt%, the joint shear strength and Vickers hardness are the highest, which are38.60 MPa and 39.8 HV0.2, respectively. The low temperature lead-free solder with Bi content of 3 wt% has the best brazing performance and the mechanical properties of the brazed joint are the best.
作者
刘广柱
岳迪
康宇
孙建宇
LIU Guangzhu;YUE Di;KANG Yu;SUN Jianyu(Academy of Materials Science and Engineering,Liaoning Technical University,Fuxin 123000,China)
出处
《热加工工艺》
北大核心
2021年第23期36-40,共5页
Hot Working Technology
关键词
无铅钎料
钎焊
润湿性
剪切强度
lead-free solder
brazing
wettability
shear strength
