摘要
结合实验结果,建立了芯片封装技术中焊点金属间化合物(IMC)界面模型,采用有限元方法计算了模型中Sn钎料与Cu焊盘形成IMC层时Cu原子的扩散过程以及扩散应力大小与分布.结果表明:IMC层与钎料的界面形貌可显著影响Cu原子扩散浓度及应力行为.凹凸界面形貌会严重阻碍Cu原子的扩散,且靠近界面影响更为显著;扇贝形界面模型比平坦界面模型更快达到扩散平稳态;最终扇贝界面模型中Cu原子浓度比平坦界面模型中Cu原子浓度小,这使得扇贝界面模型中扩散应力影响区域整体比平坦界面模型中的小.
Combining the experimental results,the intermetallic compound(IMC)interface model of welded joint in chip packaging technology was established.The diffusion process of Cu atoms during the formation of IMC layer between Sn solder and Cu substrate was calculated by finite element method,including the diffusion-induced stress and stress distribution.The results show that the interface morphology of IMC layer can significantly affect the behavior of Cu atoms diffusion and diffusion-induced stress.The concave-convex morphology of interface seriously obstructs the diffusion of Cu atoms,and the effect is more significant near the interface.The scallop morphology interface reaches diffusion stabilization faster than the flat morphology interface.The Cu atom concentration in the scallop interface is smaller than that in the flat interface,which makes the diffusion stress-affected region in the scallop interface smaller than that in the flat interface model.
作者
刘文斌
李宏萍
张旭东
孙学敏
任军强
LIU Wen-bin;LI Hong-ping;ZHANG Xu-dong;SUN Xue-min;REN Jun-qiang(Research and Development Center, Yunnan Tin Group (Holding) Company Limited, Kunming 650106, China;Network Information Center, Xi’an Jiaotong University, Xi’an 710049, China;State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou Univ. of Tech., Lanzhou 730050, China)
出处
《兰州理工大学学报》
CAS
北大核心
2022年第1期14-19,共6页
Journal of Lanzhou University of Technology
基金
国家自然科学基金(52061025)
云南省重大专项基金(202002AB080001-2)。
关键词
焊接接头
金属间化合物
扩散应力
有限元
welded joint
intermetallic compound(IMC)
diffusion-induced stress
finite element method
