摘要
详细介绍了封装结构焊点在热循环和随机振动载荷下的失效机理以及相关的研究方法,总结了几类典型的疲劳寿命预测模型;分析了焊点在热振耦合条件下的理论方法和研究现状,为后续电子元件在复杂工作环境下的可靠性研究做出了展望。
This article described the failure mechanism of electronic components under thermal cycling and random vibration loads and related research methods,and summarizes several types of typical fatigue life prediction models in detail.Subsequently,the theoretical methods and current research status of electronic components under thermal-vibration coupling conditions were analyzed,and prospects were made for the subsequent reliability research of electronic components in complex working environments.
作者
徐鹏博
吕卫民
刘陵顺
孙晨峰
XU Pengbo;LYU Weimin;LIU Lingshun;SUN Chenfeng(Naval Aviation University, Yantai 264001, China)
出处
《兵器装备工程学报》
CSCD
北大核心
2022年第6期48-54,共7页
Journal of Ordnance Equipment Engineering
基金
国家自然科学基金项目(51975580)。
关键词
焊点
疲劳失效
疲劳寿命预测模型
综述
solder joint
fatigue failure
fatigue life prediction model
summary
