摘要
综述了国内外填充型聚合物基复合材料的研究进展,详细分析了影响复合材料导热性能的因素。首先,介绍了环氧树脂、聚酰亚胺、双马来酰亚胺、聚二甲基硅氧烷等聚合物作为基体材料对封装性能的影响。其次,综述了填料类型、填料填充方式以及填料表面处理对复合材料导热性能的影响。最后,对电子封装复合材料研究工作中尚未解决的问题及研究方向提出了建议与展望。
The research progress of filled polymer matrix composites at home and abroad was reviewed.And the factors affecting the thermal conductivity of composites were analyzed in detail.Firstly,the influence of epoxy resin,polyimide,bismaleimide,polydimethylsiloxane and other polymers as matrix materials on packaging performance was introduced.Secondly,the effects of filler type,filling method and filler surface treatment on thermal conductivity of composites were reviewed.Finally,the unsolved problems and research directions of electronic packaging composites were proposed.
作者
刘佩东
胡晓丹
宋诗慧
钟奕宁
张海黔
常树全
张晓红
Liu Peidong;Hu Xiaodan;Song Shihui;Zhong Yining;Zhang Haiqian;Chang Shuquan;Zhang Xiaohong(College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 211106,China)
出处
《工程塑料应用》
CAS
CSCD
北大核心
2022年第7期160-167,共8页
Engineering Plastics Application
基金
国家自然科学基金项目(11775115)
南京航空航天大学科研与实践创新计划资助项目(xcxjh20210602)。
关键词
热导率
填料
电子封装
复合材料
树脂基
thermal conductivity
filler
electronic packaging
composites
resin-base
