摘要
以双酚A多聚甲醛酚醛树脂(BPA-PA酚醛树脂)、二甲基二甲氧基硅烷和环氧氯丙烷为原料,通过酯交换反应和亲核取代反应得到硅改性BPA-PA酚醛环氧树脂。采用傅里叶变换红外光谱(FTIR)、X射线光电子能谱(XPS)分析进行结构确证。结合非等温DSC、T-β外推直线和FTIR分析研究了最佳固化工艺条件。探讨了不同硅烷添加量对硅改性BPA-PA酚醛环氧树脂性能的影响。最后以硅改性BPA-PA酚醛环氧树脂为基体树脂,加以导电填料和助剂,制备出中温型导电胶。对导电胶进行拉伸剪切强度、体积电阻率和热重测试分析,结果显示:自制硅改性BPA-PA酚醛环氧树脂导电胶拉伸剪切强度达到20.18MPa、体积电阻率达到7.44×10^(-4)Ω·cm,残炭量达到68.89%。相对市售E-51环氧树脂所制导电胶,自制硅改性BPA-PA酚醛环氧树脂导电胶拉伸剪切强度提高5.73MPa,体积电阻率降低3.86×10^(-4)Ω·cm,残炭量提高7.49%。
Using bisphenol A paraformaldehyde phenolic resin(BPA-PA phenolic resin),dimethyldimethoxysilane and epichlorohydrin as raw materials,silicon-modified BPA-PA phenolic epoxy resin was obtained through transesterification and nucleophilic substitution reactions.FTIR and XPS were used for structural confirmation.Combining non-isothermal DSC,T-βextrapolation line and FTIR analysis,the optimal curing process conditions were studied.The effects of different silane addition levels on the properties of silicon-modified BPA-PA phenolic epoxy resin were discussed.Finally,silicon-modified BPA-PA phenolic epoxy resin was used as the matrix resin,and conductive fillers and additives were added to prepare a medium-temperature conductive adhesive.Conduct tensile shear strength,volume resistivity and thermogravimetric test analysis of its conductive adhesive were tested and analyzed.The results showed that the self-made silicon modified BPA-PA phenolic epoxy resin conductive adhesive had a tensile shear strength of 20.18 MPa,a volume resistivity of 7.44×10^(-4)Ω·cm and a residual carbon content of 68.89%.Compared with the conductive adhesive made of commercially available E-51 epoxy resin,the self-made silicon-modified BPA-PA phenolic epoxy resin conductive adhesive increased tensile shear strength by 5.73 MPa and reduced volume resistivity by 3.86×10^(-4)Ω·cm with increasing amount of residual carbon by 7.49%.
作者
郭睿
李平安
赵云飞
GUO Rui;LI Ping’an;ZHAO Yunfei(Key Laboratory of Auxiliary Chemistry and Technology for Light Chemicals,Ministry of Education,Shaanxi University of Science and Technology,Xi’an 710021,Shaanxi,China)
出处
《化工进展》
EI
CAS
CSCD
北大核心
2022年第8期4473-4480,共8页
Chemical Industry and Engineering Progress
基金
陕西省重点研发计划(2017GY-185,2017ZDXM-GY-087)
西安市科技计划[CXY1701(3)]。
关键词
硅改性
BPA-PA酚醛环氧树脂
导电胶
固化工艺条件
黏结性能
导电性能
耐热性能
silicon modified
BPA-PA phenolic epoxy resin
conductive adhesive
curing process conditions
bonding performance
electrical conductivity
heat resistance
