摘要
采用碘沉淀-分光光度法对羟基乙叉二膦酸(HEDP)镀铜溶液中聚乙二醇6000含量的测定进行了研究。结果表明:HEDP镀铜溶液中铜离子会与碘反应干扰测量结果,采用草酸屏蔽铜离子后,可以准确测定HEDP镀铜溶液中聚乙二醇6000含量,标准回收率为98.08%~99.12%,加标回收率为98.24%~98.80%,测定方法误差满足生产控制要求。
The content of polyethylene glycol 6000 in Hydroxyethylidene diphosphonic acid(HEDP)copper plating solution was determined and studied by iodine precipitation⁃spectrophotometry.Results showed that the copper ions in HEDP copper plating solution reacted with iodine and interfered with the measurement results.After shielding copper ions with oxalic acid,the content of polyethylene glycol 6000 in HEDP cop⁃per plating solution could be accurately determined.The standard recovery rate was 98.08%~99.12%,and the recovery rate of spiking was 98.24%~98.80%.Moreover,the error of measurement method could meet the requirement of production control.
作者
杨志业
崔恩状
王进军
李阳
邱媛
YANG Zhi-ye;CUI En-zhuang;WANG Jin-jun;LI Yang;QIU Yuan(AVIC,Shenyang 110850,China)
出处
《材料保护》
CAS
CSCD
2023年第3期181-182,188,共3页
Materials Protection
关键词
HEDP镀铜
无氰镀铜
聚乙二醇
分光光度法
测定
HEDP copper plating
cyanide⁃free copper plating
polyethylene glycol
spectrophotometry
measurement
