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基于物理统计模型的车载IGBT振动疲劳寿命评估研究

Evaluation and Research on Vibration Fatigue Lifetime of On-board IGBT Based on Physical-statistical Model
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摘要 在新能源乘用车车载环境中,受路面不平整度和发动机转动的影响,IGBT模块面临着振动疲劳失效的风险。为保证IGBT模块在使用过程中的可靠性,对其振动疲劳寿命进行评估具有重大意义。IGBT模块内部结构复杂,无法直接对其进行纯物理模型上的振动疲劳寿命评估。为此,文章提出了一种IGBT模块振动疲劳寿命的评估方法,其首先通过加速试验获取IGBT模块在高振动量级下失效的寿命数据;再基于威布尔分布的寿命分布统计模型获得模块在实际工况下的可靠性寿命分布,进而获取模块在实际应用中的可靠性寿命数据。试验结果表明,该方法可以有效预估IGBT模块在批量投入使用过程中的失效率,为合理管控应用风险提供保障。 In the on-board environment of new energy passenger vehicles,IGBT modules are prone to the risk of vibration fatigue failure due to the influence of road roughness and engine rotation.In order to ensure the reliability of IGBT modules in service,it is of great significance to evaluate their vibration fatigue lifetime.The internal structure of IGBT module is complicated,so it is impossible to directly evaluate the vibration fatigue lifetime based on a physical model alone.To this end,an evaluation method is proposed in this paper to determine the vibration fatigue lifetime of IGBT modules.Firstly,the failure lifetime data of IGBT modules under high vibration magnitudes are obtained by an acceleration test.Secondly,the reliability lifetime distribution under the actual working conditions is obtained from the lifetime distribution statistical model based on the Weibull distribution,and then the reliability lifetime data in the practical application is obtained.The experimental results show that this method can effectively predict the failure rate of IGBT modules used in batches,which provides guarantee for reasonable management and control of application risks.
作者 禹辉 卢圣文 陈彦 刘敏安 YU Hui;LU Shengwen;CHEN Yan;LIU Min'an(Zhuzhou CRRC Times Electric Co.,Ltd.,Zhuzhou,Hunan 412001,China)
出处 《控制与信息技术》 2023年第3期115-120,共6页 CONTROL AND INFORMATION TECHNOLOGY
关键词 IGBT模块 振动疲劳寿命 加速试验 可靠性 电动汽车 IGBT module vibration fatigue lifetime accelerated testing reliability electric vehicle
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  • 1安刚,龚鑫茂.随机振动环境下结构的疲劳失效分析[J].机械科学与技术,2000,19(z1):40-42. 被引量:24
  • 2梅杨,孙凯,黄立培.基于逆阻式IGBT的三相/单相矩阵式变换器[J].电工技术学报,2007,22(3):91-95. 被引量:15
  • 3Chin-Hsiang Cheng,Shu-Yu Huang,Tsung-Chieh Cheng.A three-dimensional theoretical model for predicting transient thermal behavior of thermoelectric coolers[J].International Journal of Heat and Mass Transfer.2009(9)
  • 4M. Horio,et al."Investigations of High Temperature IGBT Module Package Structure,"[].Proceedings of PCIM Europe.2007
  • 5Onuki, Jin,Koizumi, Masahiro,Suwa, Masateru.Reliability of thick Al wire bonds in IGBT modules for traction motor drives[].IEEE Transactions on Advanced Packaging.2000
  • 6Shaoyong Yang,Angus Bryant,Philip Mawby.An Industry-Based Survey of Reliability in Power Electronic Converters[].IEEE Transactions on Industry Applications.2011
  • 7Morozumi, Akira,Yamada, Katsumi,Miyasaka, Tadashi,Sumi, Sachio,Seki, Yasukazu.Reliability of power cycling for IGBT power semiconductor modules[].IEEE Transactions on Industry Applications.2003
  • 8Nishimura Y,et al.Development of ultrasonic welding forIGBT module structure[].Power Semiconductor Devices&IC’’s (ISPSD).2010
  • 9Yoshinari IKEDA,Hiroaki HOKAZONO,Shigeru SAKAI,et al.A study of the bonding-wire reliability on the chip surface electrode in IGBT[].Proceedings of the nd International Symposium on Power Semiconductor Devices&ICs.2010
  • 10Yoshinari IKEDA,Yuji IIZUKA,Tatsuhiko ASAI,et al.A study on the reliability of the chip surface solder joint[].Proceedings of The nd International Symposium on Power Semiconductor Devices&ICs.2008

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