摘要
随着倒装芯片LED(FC LED)技术的发展,FC LED在其性能工艺等方面都有了很大的改进,焊接时产生的问题日益突出,对焊接工艺的要求越来越高。焊接时如操作不当会产生空洞,空洞的存在对FC LED的可靠性会产生较大的影响。本文综述了倒装芯片(FC LED)的发展现状、研究热点、相关技术,主要介绍了焊接工艺及其可靠性影响。
With the development of flip-chip LED(FC LED)technology,the performance of FC LED has been greatly improved in the process,welding problems have become increasingly prominent,more and more high requirements on the welding process.If the welding operation is improper,there will be voids.Voids will have a greater impact on the reliability of FC LED.In this paper,the development,research focus,and related technologies of flip-chip LEDs(FC LED)are described,the welding process and its reliability mainly introduced.
作者
聂呈呈
NIE Chengcheng(Shandong Environmental Energy Design Institute Co.,Ltd.,Jinan 250013,China)
出处
《中国照明电器》
2023年第2期5-12,共8页
China Light & Lighting
