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一种航空温度压力组合传感器的设计与制备 被引量:2

Design and Preparation of an Aviation Temperature and Pressure Combination Sensor
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摘要 设计了一种基于PT100感温元件和压力充油芯体的温度压力组合传感器。感温元件采用铠装铂电阻总体设计结构,通过快速响应封装和精度调节技术,优化了温度部分的响应时间和精度。压力传感器芯片采用绝缘体上硅(SOI)材料,解决了高温漏电流问题。基于耐高温充油封装,搭配二极管/电阻网络补偿方法,传感器实现了-55~150℃温区内的高精度输出。通过振动特性仿真分析,验证了传感器总体结构的稳定性和可靠性。测试结果表明,传感器温度精度达到A级,25℃下压力精度为-0.19%FS,线性度为-0.13%FS,温度漂移为-0.0045%FS/℃。传感器最大外廓尺寸为Φ26 mm×85 mm,质量为130 g。 The temperature and pressure combination sensor based on PT100 temperature sensing element and oil filled pressure core was designed.The overall design structure of shield platinum resistor was adopted in the temperature sensing element.The response time and precision of temperature part were optimized by rapid response packaging and precision adjustment technologies.The silicon on insulator(SOI)material was used in the pressure sensor chip to solve the problem of high-temperature leakage current.Based on high temperature oil filled package and diode/resistor network compensation method,the sensor achieves high precision output in the temperature range of-55-150℃.Through the simulation analysis of the vibration characteristics,the stability and reliability of the overall structure of the sensor were verified.The test results show that the temperature accuracy of the sensor reaches class A,the pressure accuracy is-0.19%FS at 25℃,the linearity is-0.13%FS,and the temperature drift is-0.0045%FS/℃.The maximum profile size of the sensor isΦ26 mm×85 mm,and the mass is 130 g.
作者 涂孝军 李闯 温学林 林俞帆 何家强 Tu Xiaojun;Li Chuang;Wen Xuelin;Lin Yufan;He Jiaqiang(Engineering Training Center,Soochow University,Suzhou 215131,China;Suzhou Changfeng Avionics Co.,Ltd.,Suzhou 215151,China)
出处 《微纳电子技术》 CAS 北大核心 2023年第10期1646-1654,共9页 Micronanoelectronic Technology
基金 中航航空电子“十四五”核心竞争力创新项目(YC2228)。
关键词 温度压力组合传感器 铠装铂电阻 充油封装 网络补偿 高精度 temperature and pressure combination sensor shield platinum resistor oil filled package network compensation high precision
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  • 1武宇,赵湛,方震,张博军.基于聚酰亚胺的温湿压集成传感器[J].仪器仪表学报,2004,25(z3):101-103. 被引量:4
  • 2张栋,王维博,马波,何航,刘勇,谢东,郑永康.基于线性插值的采样值估计算法及误差分析[J].自动化与仪器仪表,2016(4):231-233. 被引量:2
  • 3张文栋,石云波.新型复合硅微传感器的设计[J].纳米技术与精密工程,2004,2(1):24-28. 被引量:2
  • 4赵妍,刘志珍.基于MAX1452的压力传感器温度补偿[J].电气应用,2006,25(4):137-139. 被引量:11
  • 5徐敬波,赵玉龙,蒋庄德,张大成,杨芳,孙剑.基于SOI的集成硅微传感器芯片的制作[J].Journal of Semiconductors,2007,28(2):302-307. 被引量:9
  • 6DEHENNIS A D,WISE K D.A wireless microsystem for the remote sensing of pressure,temperature and relative humidity[J].Journal of Microelectromechanical Systems,2005,14:12-22.
  • 7NORLIN P,OHMAN O,EKSTROM B,et al.A chemical micro analysis system for the measurement of pressure,flow rate,temperature,conductivity,UV-absorption and fluorescence[J].Sensors and Actuators B,1998,49:34-39.
  • 8HYLDGARD A,HANSEN O,THOMSEN E V.Fish& chips:single chi Psilicon MEMS CTDL salinity,temperature,pressure and light sensor for use in fisheries research[C].IEEE MEMS2005:303-306.
  • 9DIEM B,REY P.SOI 'SIMOX' from bulk to surface micromaching:a new age for silicon sensors and actuators[J].Sensors and Actuators A,1995,46-47:8-16.
  • 10XU J B,ZHAO Y L,JIANG ZH D,et al.A monolithic multi-sensor for three-axis accelerometer,absolute pressure and temperature[J].IEEE Sensors 2006:1049-1052.

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