摘要
采用Cu-B合金为基体,选用粒径分别为110、230、550μm的金刚石颗粒作为增强体,利用气压熔渗工艺在1100℃、10 MPa气体压力下制备金刚石/Cu-B合金复合材料,研究金刚石颗粒粒径对复合材料组织结构、界面相分布及热物理性能的影响。结果表明,随着金刚石粒径的增大,复合材料热导率上升,热膨胀系数减小,复合材料界面处硼碳化合物含量增加,界面结合情况得到改善。由金刚石颗粒粒径为550μm时,复合材料热导率最高,可达680.3 W/(m·K),热膨胀系数最小,为4.905×10^(−6)K^(−1),符合高效热管理器件对金刚石/金属基复合材料的热物理性能要求,在电子产品散热器件方面具有良好的应用前景。
Using copper-boron alloy as the metal matrix and different-sized diamond particles through 110μm,230μm to 550μm as reinforcement,the diamond/copper-boron alloy composites were prepared via gas pressure infiltration technology under 1100℃and 10 MPa gas pressure.The influences of the size of diamond particles on the configuration,interlayer phase distribution,and thermophysical properties of the composites were investigated.The results show that with the increase of particle size,there is a benefit of better interface bonding,and the thermal conductivity of the diamond/copper-boron composite is enhanced while the thermal expansion coefficient decreases.When the diamond particle size is 500μm,the best performance of the composite is obtained.The thermal conductivity is 680.3 W/(m·K),and the thermal expansion coefficient increases from 4.095×10^(−6)K^(−1)to 7.139×10^(−6)K^(−1).
作者
王熹
康翱龙
焦增凯
康惠元
吴成元
周科朝
马莉
邓泽军
王一佳
余志明
魏秋平
WANG Xi;KANG Aolong;JIAO Zengkai;KANG Huiyuan;WU Chengyuan;ZHOU Kechao;MA Li;DENG Zejun;WANG Yijia;YU Zhiming;WEI Qiuping(School of Materials Science and Engineering,Central South University,Changsha 410083,China;State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China;Center for Advanced Studies,Central South University,Changsha 410083,China)
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2024年第2期169-178,共10页
Diamond & Abrasives Engineering
基金
国家“十四五”重点研究发展计划(2021YFB3701800)
国家自然科学基金(52071345,51874370,51601226)
广东省“十三五”重点研究开发项目(2020B01085001)
湖南省高新技术产业科技创新引领计划(2022GK4037,2022GK4047)
湖南省教育厅资助科研项目(20C0037)。
关键词
热导率
金刚石粒径
气压熔渗
热膨胀系数
金刚石/Cu-B复合材料
thermal conductivity
diamond particle
gas pressure infiltration method
thermal expansion coefficient
diamond/copper-boron composite material
